Industry Directory: pre bake bga (17)

Chip Process Inc.

Industry Directory | Consultant / Service Provider

Lead Conditioning, Lead Scanning, Tape & Reel, Lead Tinning, Bake & Dry-Pack, BGA Reballing Services

ALLTEMATED, INC.

Industry Directory | Manufacturer

Alltemated sets the standard for tape and reel packaging, IC programming, lead trim/forming, bake and dry-pack services and carrier tape manufacturing.

New SMT Equipment: pre bake bga (146)

BGA Rework Training & Certification

BGA Rework Training & Certification

New Equipment | Education/Training

This course is designed for students that require the hands-on skill and knowledge to reliably remove and install many types of the most complex BGA components. Students are taught methods for safe and reliable BGA component rework using a top of the

Precision PCB Services, Inc

BGA Reballing Fixtures & Kits

BGA Reballing Fixtures & Kits

New Equipment | Solder Materials

Easily Reball BGA components for as little as a penny each.  No solder paste required.  Re-Ball components using our water wash tacky flux. No more expensive and hard to order solder pre-forms. Call (888) 406-2830

Precision PCB Services, Inc

Electronics Forum: pre bake bga (371)

PCB bake

Electronics Forum | Sat Jan 19 02:29:11 EST 2002 | ianchan

Thanks for the tips... found out the ex-employee guy, had pre-bake conditioning put into the process flow, as this pcb is made of polymide material, that is reputed to have historical patterns in thermal sensitivity. To avoid "thermal damaging" the

BGA bake out....

Electronics Forum | Mon Jun 28 14:30:46 EDT 2004 | davef

There multiple potental causes of BGA curling during reflow. One of them is moisture inclusion in the part, as Francois mentiones above in this thread. Another has to do with the construction of a BGA. So, from our perspective, more often the mois

Used SMT Equipment: pre bake bga (5)

Panasonic CM402 Pick and Place Machine

Panasonic CM402 Pick and Place Machine

Used SMT Equipment | Pick and Place/Feeders

The NPM-TT2 (Next Production Modular-Twin Tray II) platform represents the next generation in twin tray modular production from Panasonic’s award-winning NPM platform—ideal for any mix. Further bolstering the SMT process to accommodate m

KingFei SMT Tech

Hakko FR1418-01 BGA Rework

Hakko FR1418-01 BGA Rework

Used SMT Equipment | Repair/Rework

Hakko FR1418-01 BGA Rework System 2004 Vintage (1) 222-529 pan and tilt mirror (retrofit) (1) optics calibration plate (2) 222-536 Long reach edge supports (1) 222-526 Bottom board rail support (1) Left or right rail support (9) Precision Manufactu

SMT Surplus, LLC

Industry News: pre bake bga (92)

MIRTEC to Premier Its AOI Series at APEX 2008

Industry News | 2008-02-28 21:48:17.0

OXFORD, CT � February 2008 � MIRTEC a leading global supplier of AOI systems to the electronics manufacturing industry, announces that it will introduce its MV series of AOI systems in booth 1857 at the upcoming APEX exhibition & conference scheduled to take place April 1-3, 2008 in Las Vegas.

MIRTEC Corp

MIRTEC Europe and pb tec solutions to Display Revolutionary 2D/3D AOI Technology at SMT/Hybrid/Packaging 2015

Industry News | 2015-04-07 11:25:45.0

MIRTEC will highlight its award-winning 2D/3D In-Line AOI Series configured with MIRTEC’s exclusive OMNI-VISION® 3D Inspection Technology in its distributor pb tec solutions’ booth, # 7A-504, at the SMT/Hybrid/Packaging 2015 exhibition, scheduled to take place May 5-7, 2015 at the Messe in Nuremberg, Germany.

MIRTEC Corp

Technical Library: pre bake bga (3)

BGA Reballing

Technical Library | 2019-05-30 10:59:13.0

In the current economic environment, the ability to reuse ball grid array(BGA) components that have failed due to solder defects may be an efficient way for electronics manufacturers to reduce costs. Cost may not be the only driving factor in the decision to engage in this recycling practice. The increasing demands placed upon the complexity of microprocessors and integrated circuits (ICs) has decreased the availability of some components, and increased their lead time. Because of this, reballing may provide a means to meet schedule, reduce rework turn-around time, and give a manufacturer a decisive advantage over other companies in an ever increasingly competitive market. This article will discuss the process of reballing BGA components (Figure 1), examining preparation (the preform method, the screen method), and cleaning and bake-out.

ACI Technologies, Inc.

Maximizing Efficiency: The High-Speed SMT Line With Laser Depanelizer

Technical Library | 2024-02-02 07:48:31.0

Maximizing Efficiency: The High-Speed SMT Line With Laser Depanelizer In today's rapidly evolving electronics manufacturing landscape, optimizing efficiency, cost-effectiveness, and precision remains paramount. Businesses engaged in producing industrial control boards, computer motherboards, mobile phone motherboards, and mining machine boards face ongoing challenges in streamlining production processes. The integration of expensive equipment strains budgets, making the creation of an efficient, cost-effective high-speed SMT line a daunting task. However, a solution exists that seamlessly combines these elements into a singular, high-performance, and cost-effective SMT line. Let's delve into the specifics. A Comprehensive High-Speed SMT Line Our innovative solution amalgamates two pivotal components: a cutting-edge SMT (Surface Mount Technology) production line and a laser cutting line equipped with a depanelizer. The SMT Production Line The high-speed SMT line comprises several essential components, each fulfilling a unique role in the manufacturing process: 1. PCB Loader: This initial stage involves loading boards onto the production line with utmost care. Our Board Loader prioritizes safety, incorporating various safety light curtains and sensors to promptly halt operations and issue alerts in case of any anomalies. 2. Laser Marking Machine: Every PCB receives a unique two-dimensional code or barcode, facilitating comprehensive traceability. Despite the high-temperature laser process potentially leading to dust accumulation on PCB surfaces, our dedicated PCB Surface Cleaner swiftly addresses this issue. 3. SMT Solder Paste Printer: This stage involves applying solder paste to the boards, a fundamental step in the manufacturing process. 4. SPI (Solder Paste Inspection): Meticulous inspections are conducted at this stage. Boards passing inspection proceed through the NG (No Good) Buffer Conveyor to the module mounters. Conversely, "No Good" results prompt storage of PCBs in the NG Buffer Conveyor, capable of accommodating up to 25 PCBs. Operators can retrieve these NG boards for rework after utilizing our specialized PCB Mis Cleaner to remove solder paste. 5. Module Mounters: These machines excel in attaching small and delicate components, necessitating precision and expertise in the module mounting process. 6. Standard Pick And Place Machines: The selection of these machines is contingent upon your specific BOM (Bill of Materials) list. 7. Pre-Reflow AOI (Automated Optical Inspection): Boards undergo examination for component quality at this stage. Detected issues prompt the Sorting Conveyor to segregate boards for rework. 8. Reflow Oven: Boards undergo reflow soldering, with our Lyra series reflow ovens recommended for their outstanding features, including nitrogen capability, flux recycling, and water cooling function, ensuring impeccable soldering results. 9. Post-Reflow AOI: This stage focuses on examining soldering quality. Detected defects prompt the Sorting Conveyor to segregate boards for further inspection or rework. Any identified defects are efficiently addressed with the BGA rework station, maintaining the highest quality standards. 10. Laser Depanelizer: Boards advance to the laser depanelizer, where precision laser cutting, often employing green light for optimal results, ensures smoke-free, highly accurate separation of boards. 11. PCB Placement Machine: Cut boards are subsequently managed by the PCB Placement Machine, arranging them as required. With this, all high-speed SMT line processes are concluded. Efficiency And Output This production line demonstrates exceptional productivity when manufacturing motherboards with approximately 3000 electronic components, boasting the potential to assemble up to 180 boards within a single hour. Such efficiency not only enhances output but also ensures cost-effectiveness and precision in your manufacturing processes. At I.C.T, we specialize in crafting customized SMT production line solutions tailored to your product and specific requirements. Our equipment complies with European safety standards and holds CE certificates. For inquiries or to explore our exemplary post-sales support, do not hesitate to contact us. The I.C.T team is here to elevate your electronics manufacturing to new heights of efficiency and cost-effectiveness.

I.C.T ( Dongguan ICT Technology Co., Ltd. )

Videos: pre bake bga (21)

BGA Reballing and Reflowing

BGA Reballing and Reflowing

Videos

Demo on how to reball a BGA component using a universal reball fixture.

Precision PCB Services, Inc

BGA Rework Stations - How to Evaluate

BGA Rework Stations - How to Evaluate

Videos

Dennis Odonnell , Vice President of Precision PCB Services, Inc., Oroville CA Explains How to Evaluate a BGA Rework Station ! #BGA Rework Stations http://www.pcb-repair.com/bga-rework-station/

Precision PCB Services, Inc

Training Courses: pre bake bga (6)

BGA Rework Training & Certification

Training Courses | | | PCB Rework and Hand Soldering Courses

The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.

Precision PCB Services, Inc

BGA Rework Training & Certification

Training Courses | | | PCB Rework and Hand Soldering Courses

The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.

Precision PCB Services, Inc

Career Center - Jobs: pre bake bga (6)

CSP/BGA Applications Engineer

Career Center | , | Engineering

A well respected, cutting edge technology leader in underfill chip scale packaging electronic materials for uses in cell phone, wireless applications and more is in need of a particular combination of experience in process engineering, CSP equipment

Eden Associates

Sr SMT Process Engineer

Career Center | Seymour, Connecticut USA | Engineering

Develop and manage SMT assembly and soldering processes and associated staff in medium volume/high-mix printed circuit board assembly operation for complex quality class 2/3 assemblies. DUTIES AND RESPONSIBILITIES: Plan and develop processes a

Sales Consultants of Buffalo

Career Center - Resumes: pre bake bga (9)

TECHNICIAN

Career Center | THRISSUR, India | Maintenance,Production

HANDLING OF MAINTENANCE Camelot,Mascot, Selective Soldering,Wave Soldering,Aquastorm 200,H-500 HI-Z,Kolb,kerry&PBT,GETECH, ATI 105 & Final Touch 101,Heller,Btu&vapour phase,Shuttle,SRT,ESD ,Electrical maintenance . Knowledge in using SLIM KIC 2000&

Global Product Specialist

Career Center | Singapore, Singapore | Engineering,Production

I am a result/goal-oriented engineer with 20 years of experience in Surface Mount Technology (SMT) environment, of which 7 years were heavily involved in field service and field application for Automated Optical Inspection (AOI) machines. I partici

Express Newsletter: pre bake bga (528)

Partner Websites: pre bake bga (146)

Used Surface Mount I Pre-owned PCB Assembly - Lewis and Clark, Inc.

Lewis & Clark | https://www.lewis-clark.com/

Used Surface Mount I Pre-owned PCB Assembly - Lewis and Clark, Inc. Skip to content My Cart:  $ 0.00 0 View Cart Checkout No products in the cart. Subtotal

Lewis & Clark

AirVac PBCRM 12 or 15 Pre-Heater Rework Station_ID 111622: World Equipment Source

| https://www.wesource.com/rework-systems-and-accessories/airvac-pbcrm-12-or-15-pre-heater-rework-station-id-111622/

AirVac PBCRM 12 or 15 Pre-Heater Rework Station_ID 111622: World Equipment Source COMPANY PROFILE FINDER'S PROGRAM R1-Surplus Wesource159   CALL US


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